IC die bonding is a key piece of equipment in semiconductor packaging. It is primarily used to precisely pick up chips (dies) from wafers and mount them onto a substrate, then secure them using methods such as epoxy resin, eutectic bonding, or laser bonding
Case Details
IC Die Bonding MachineIC die bonding is a key piece of equipment in semiconductor packaging. It is primarily used to precisely pick up chips (dies) from wafers and mount them onto a substrate, then secure them using methods such as epoxy resin, eutectic bonding, or laser bonding.
Industry ChallengesSpeeding increases encounter bottlenecks, UPH (Uptime Per Hour) is difficult to improve
Positioning accuracy + force control accuracy
Positioning deviation < ±20um, force control requires a maximum accuracy of 2g
High-speed equipment vibration
Affecting die bonding yield and mechanical lifespan
Requirements on cost and installation space
30+ axes, high I/O
Solution FeaturesLow communication time
Low bus command time, short master control cycle
High positioning accuracy
Servo super tracking function, fast response
Flexible start/stop
Provides soft start, soft landing, and high-order speed curves
Convenient debugging
Easy debugging, EtherCAT networking communication, batch parameter download
Realized ValueMachinery stability amplitude reduced by 10%
Flying camera function shortened by 30%
UPH increased by 10%
Command time reduced by 10 times
