The PVD & RPD photovoltaic loading and unloading machine is the loading and unloading equipment in HJT's TCO conductive film fabrication process. PVD fabrication of the TCO conductive film is a double-sided deposition process and is the third step in HJT's process, requiring high precision. The theoretical precision of the gap between the carrier and the silicon wafer is 0.1mm, but in practice, a gap within 0.2mm is sufficient.
Case Details
HJT Automated Loading and UnloadingThe PVD & RPD photovoltaic loading and unloading machine is the loading and unloading equipment in HJT's TCO conductive film fabrication process. PVD fabrication of the TCO conductive film is a double-sided deposition process and is the third step in HJT's process, requiring high precision. The theoretical precision of the gap between the carrier and the silicon wafer is 0.1mm, but in practice, a gap within 0.2mm is sufficient. The loading and unloading machine transports the silicon wafers to the fixture pick-up position via belt conveyor. After the fixture clamps the silicon wafers, it is placed into the carrier's wafer storage slot, and then the carrier filled with silicon wafers is sent into the process chamber for film deposition.
Challenges Facing the IndustryDifficulty in Improving the Correction CT (Cyclic Cross-Section), Long Debugging Cycles
Currently, the cycle time of domestic equipment is generally above 1.8 seconds. Customers expect to break through 0.7 seconds, and the carrier-to-wafer precision should be < ±0.15mm to increase competitiveness in the industry.
Compact space and cumbersome wiring make soldering and troubleshooting difficult. Numerous drivers and network cables, a large absolute value battery box with challenging soldering, consume significant cabinet space and incur high labor and wiring costs; customers desire space-saving, time-saving, and labor-saving solutions.
High overall cost and low debugging efficiency. The large number of axes requiring alignment increases control costs, while debugging efficiency remains low and troubleshooting is difficult.
Solution FeaturesOne-time alignment and correction technology. This technology optimizes the original two-step imaging and two-step correction process to one-step imaging and one-step correction, reducing the number of XYθ movements on the alignment platform and significantly improving equipment cycle time.
All-in-one customized product
Solve the problems of limited space in electrical control cabinets; cumbersome wiring; and difficult troubleshooting.
Delivering valueFour drives installed in a single battery box, saving 75% on labor and material costs (drive + battery box + power cord + communication cable).
One-to-four axis alignment drive with a width of only 40mm (the size of a single-axis drive), saving over 50% of space.
Configured with a stepper motor + servo solution, saving 30% on overall cost and over 50% on installation space.
Stronger axis control capability up to 128 axes.
XYZR uses a single MCU, resulting in faster system response and a 30% improvement.